GLP-200W |
|
Grinder for Superhard Materials
Grinding machine which capable to grind wafer of resistant materials(SiC,LT,GaN,AL2O3)which high speed ,high accuracy |
|
|
|
Support Non-Contact grinding. Best function for grinding the laminated thin wafer etc |
|
High rigidity configuration |
|
Working time is shortened remarkably by the structure considering the improvement of work efficiency. |
|
Selectable 3 process mode |
|
Dramatic improvement on TTV |
※Non-contact grinding is an option |
|
|
|