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PWS-E (Electroplated type)

PWS-R (Resin bond type)

	2 to 10 times higher efficient sawing compared to loose abrasive method
	Improvement of working conditions due to use of water soluble cutting fluid
	Improvement of environment due to separate collection of chip from wastes
	Various specifications available

	Cutting of glass, ceramics, quartz, sapphire and other brittle materials
	Cutting of silicon ingots for semiconductor devices and solar cells
	Cutting of magnetic materials such as neodymium and ferrite magnets
	Cutting of various ingots, SiC and substrates