CEO Greeting
Company Overview
Quality Policy
Certification
Partner
Organization
Location
Multi Wire Saw
Used Equipment
Lapping & Polishing
Diamond Wire
Products
Consumables
Application
Equipment
Measuring instrument
Technical Data
Application Movie
Notice
Inquiry
Board
HOME > Business Info > Multi Wire Saw
WSD-K2
Best suited for sample wafering with the use of Diamond wire
High precision slicing achieved by high wire tensioning &
Takatori Original Rocking System
Simple mechanical design and easy oeration with the use of Touch Panel Operation
Screen
Reasonably priced for labs and evaluation purposes
Max Work Size(W*H*L)
156*156*100
Max. wire speed
500m/min
Rocking angle
0 ~±10
Wire Tension
40N
machine Dimensions(W*H*L)
1000*1750*1100
;)
