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HOME > Business Info > Multi Wire Saw
GLP-200W
Grinder for Superhard Materials
Grinding machine which capable to grind wafer of resistant materials(SiC,LT,GaN,AL2O3)which high speed ,high accuracy
Support Non-Contact grinding. Best function for grinding the laminated thin wafer etc
High rigidity configuration
Working time is shortened remarkably by the structure considering the improvement of work efficiency.
Selectable 3 process mode
Dramatic improvement on TTV
※Non-contact grinding is an option
Work size
φ100 ～ φ 200 (4,6,8inch) （厚み）thickness 100μm ～ 999μm
Grinding Whee
Select from size φ200、φ300
Spindle Rotationa
MAX 3000RPM
Work table
Vacuum chuck
Machine dimensions / cell
W 3000mm × D 1400mm × H 2400mm
Machine weight / per cell
about 7000kg
Option
grinding lubricant circulating system
※ Specifications are subject to change without prior notice.
;)